exposed diepad dimensions leadframe c66065-a6866-c005 package pg-lqfp-64-8 c66065-a6866-c013 pg-lqfp-64-6 c66065-a6866-c020 pg-lqfp-64-19 c66065-a6866-c018 PG-LQFP-64-12 ex 5 5.6 5.8 4 ey 5 5.6 5.8 4 oy 0 0 0 0 ox 0 0 0 c66065-a6866-c019 pg-lqfp-64-6, -22 5.4 5.4 0 0 0 e x e y 0.29 0.5 thermal pad 1.35 1.35 0.5 11.45 11.45 0.29 p/pg-lqfp-64-6, -8, -12, -19, -22 package information published by infineon technologies ag package outline foot print soldering type: reflow soldering d 12 h 0.2 a-b d 4x a-b 0.2 64x d b 12 1 64 64 1 index marking index marking 0.5 15 x 0.5 = 7.5 +0.07 0.2 -0.03 0.08 m a-b d c coplanarity seating plane c 0.08 0.05 0.1 stand off 0.05 1.4 1.6 max. 0.15 0.6 h a -0.06 +0.05 0.15 0...7 64x 64x c 10 0.5 x 45 1) 10 1) 1) does not include plastic or metal protrusion of 0.25 max. per side bottom view exposed diepad ox oy ex ey http://
pin 1 marking 123456789 xxxxxxxxxxx emc assembly site code (e for infineon mal) manufacturer 123456789 123456789 g date code (yyww) type code g = green product moulding compound code 7.62 135.9 315 13 15.7 mark for pin 1 15.2 13.1 p/pg-lqfp-64-6, -8, -12, -19, -22 package information marking layout tape and reel pieces/tray: 160 trays/box: 1; 6 bakable tray reel ?330 mm: 1.900 pieces/reel reels/box: 1 16 12.35 12.35 24 0.3 2.05 1.55 index marking published by infineon technologies ag http://
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